Void Cards
Tamper-Evident Packaging
Void cards are used when opening or tampering with the packaging needs to leave a visible, inspectable sign. The effect and attachment method are selected around the product format and packaging material so complementary features can align with the distribution process and product-inspection method.
Solution elements
Inspectable signs start with the right packaging structure.
A Void card is not defined in isolation: its structure, attachment method, and complementary features should align with the product and project process.
- 01
Card Structure and Attachment Method
Card format and attachment method are aligned with the product and packaging materials. The attachment area is selected around the part of the packaging where opening or alteration needs to leave an inspectable sign.
- 02
Complementary Security Features
Alongside the Void structure, security printing, embossing, and other project-appropriate features can be considered. Where needed, a unique identifier can also be incorporated into the solution design.
- 03
Process Compatibility
Equipment and quality-control measures are reviewed around the chosen structure so packaging can be applied with consistent, repeatable quality and the card’s expected performance can be evaluated.
Product fit
Void cards for coins, melted gold, gold bars, silver bars, and—where suitable—Parsian plaques.
Choose a piece to place it inside the packaging.

Selected piece placed
For bank-issued coin packaging, a Void card can be placed on the part of the packaging where opening or alteration needs to leave an inspectable sign.
What to review before choosing
- The coin packaging format and dimensions inform the attachment area.
- The part of the packaging whose opening should remain inspectable is identified.
- The distribution and inspection method informs the final structure.
This combination is generally not cost-effective. A custom configuration can be reviewed around the piece, cost and project requirements.
Void-card use for Parsian plaques is reviewed as a custom option around plaque dimensions, packaging structure, and project requirements.
What to review before choosing
- Plaque dimensions and packaging space inform the attachment area.
- Packaging material and the area whose change should be inspectable are identified.
- The buyer presentation method and project requirements are aligned with the final structure.
For gold bar packaging, a Void card is evaluated as a cost-effective option so the packaging structure and visible signs align with the distribution method.
What to review before choosing
- Bar and packaging format inform the card structure.
- The attachment area should align with the inspectable packaging section.
- Physical protection and the product presentation path are evaluated together.
For silver bar packaging, a Void card is evaluated as a cost-effective option so the packaging structure and visible signs align with the distribution method.
What to review before choosing
- Bar and packaging format inform the card structure.
- The attachment area should align with the inspectable packaging section.
- Physical protection and the product presentation path are evaluated together.
For melted-gold packaging, a Void card is evaluated as a cost-effective option so the attachment area and inspectable signs align with the packaging structure.
What to review before choosing
- The item format and packaging structure inform the attachment area.
- The attachment area is selected without disrupting product presentation.
- Distribution method and sign inspection inform the final structure.
Related projects

Related project
Dayagold
Coin packaging with a tamper-evident hologram integrated with the coin and card.
Project details
Related project
Qom Gold and Jewelry Union
Bank-issued coin packaging with a tamper-evident hologram and a dedicated serial number.
Project details
Related project
Motiha melted gold
Melted-gold packaging with a unique identifier and disclosed security features.
Project detailsRelated paths
Solutions and Equipment Related to Void Cards
Use these paths to review the packaging structure, inspectable signs, attachment method, and Void-card execution around your project.